At the same time, upstream and downstream manufacturers in MiniLED industry are actively reducing costs through other methods while developing new technologies.In general, at present, domestic and foreign Mini LED manufacturers focus on the research and development of new technologies, including light regulation chip, COB and IMD package, Mini LED mass transfer, TFT circuit backboard, flexible substrate, and so on.

1. Output light adjustment chip

When used in the Mini LED backlit, adopt a large number of LED chips as the straight down type back light, in order to adjust the chip out of the light, making it easier to implement an ultra-thin design, HuaCan photoelectric optimization in traditional backlit chip membrane layer, can promote the chip out of light Angle, so as to make the LED chip light more even, enhance the display effect.

2. COB and IMD packaging

Currently, the COB package directly encapsulates the LED bare chip to the module substrate, and then carries on the overall die sealing, compared with the traditional SMD package.This COB encapsulated full-color LED module has the characteristics of less manufacturing process, lower packaging cost, high packaging integration, good reliability of display screen and uniform and exquisite display effect, which is expected to be an important packaging form of high-density LED display module in the future.Currently, since the industrial chain of COB has not been established and improved, the cost per unit area of COB products is higher than that of SMD. In the future, with the gradual maturity of the industrial chain of COB display packaging, the market share of COB display packaging is expected to increase rapidly.

The star electric is used to display the Mini LED released in June, with integrated packaging technology (IMD), i.e. array of four unity wrap, horizontal and vertical separately in two lights, consisting of small units, each lamp bead is still RGB trichromatic chip packaging, break through the traditional design thinking, brings together the advantages of SMD and COB, this will be the prelude to COB encapsulation large-scale application.

3. Mini LED mass transfer

Relative to the Micro LED a huge amount of transfer technology, Mini LED chip size is larger, so the difficulty of transfer is relatively small, combined with the huge amount of transfer and COB packaging technology, can effectively improve the Mini LED production cycle, the current Uniqarta laser transfer technology, laser beam can be through a single or multiple laser beam do transfer way, about 14 million 130 x160 microns per hour shift LED chip.

4. TFT backplane

If you want to compete with OLED on realistic effects, the Mini LED backlight + LCD need to be top of HDR, namely Local Dimming back light dimmer partition number (Local DimmingZones) must be hundreds or even thousands of area is enough, but if the traditional LED back light driver circuit architecture, the idea will too many components use, at the expense of the cost and lightweight design.In view of this, innolux proposed AM Mini LED architecture driven by active matrix TFT circuit.

5. Flexible substrate

MiniLED backlight is generally USES the straight down type design, through a large number of, so as to realize a smaller area within the scope of that move light, because its design can match the flexible substrate, cooperate with the surface of the LCD is able to guarantee the quality of similar surface of OLED display, but because of the Mini LED number, heat, and the heat resistance of flexible substrate is often poor, so the research and development of flexible substrates with high heat resistance also will be one of the technical trend of the future.